Use of indium

Examples of indium applications and structures in the United States and Japan.
Table 1 Application examples and structure of indium (%)
years
Country
application
ITO
Low melting alloy
Semiconductor + phosphor
Bearing
other
1985
United States
25.0
31.7
5.8
-
37.5
Japan
28.6
24.6
19.6
4.1
23.1
1996
United States
45
35
15
-
5
Japan
60.0
20.9
16.0
1.0
3.1
1997
United States
45
35
15
-
5
Japan
79.5
11.6
7.2
0.4
1.3
1998
United States
50
33
12
-
5
Japan
78.9
2.9
13.0
0.5
4.7
1999
United States
50
33
12
-
5
Japan
81.9
2.2
11.8
0.4
3.7
2000
United States
49
33
14
-
4
Japan
80.2
6.2
11.4
-
2.5
2001
United States
49
33
15
-
3
Japan
83.3
4.0
11.6
-
1.5
1. Indium compound semiconductors are used in optical communication, infrared detectors, light-emitting diodes, high-efficiency photovoltaic cells, and high-speed transistors.
Second, ITO transparent electrode is mainly used for liquid crystal display, conductive polymer and solar cell, also used as electroluminescent element for defogging/ice device of airplane car and other spoiler, used as transparent heat reflector and used as infrared window , architectural glass windows and oven door.
3. Indium and indium-based alloys have wear-resisting and corrosion-resistant properties and good mechanical properties. They are specially used as high-speed Engine bearings, acid-base environments and marine instruments, decorative and souvenir coatings.
Fourth, indium and gallium, bismuth, lead, cadmium, tin, thallium, etc 1.45-154 ℃ series fluxing low (see Table 2), is automatically controlled, the filler profile of the workpiece, the clip jewelry processing material (after Both are easy to remove and reuse after use). Used as aluminum wire joint coating and control rods for the nuclear industry.
Table 2 Indium-based low-melting alloy (the remainder of the component is indium)
Melting point / °C
1.45
18
33
44.5
46.5
54
57.5
Component /%
Sn
12.5
12.5
8
8.3
10.8
11.5
12
Pb
25
25
21.1
22.6
22.4
17.9
18
Bi
50
50
42.9
44.7
40.6
49.1
49
Cd
12.5
-
5
-
8.2
0.5
-
other
-
-
-
-
-
-
-
Melting point / °C
60
70
81
90.5
93
108
109.5
Component /%
Sn
-
1.0
16.3
16-18
42
46
48
Pb
-
39.2
-
30-32
-
-
-
Bi
30.8
50.3
54.0
52
-
-
-
Cd
7.5
8.0
-
-
14
-
-
other
-
-
-
-
-
Zn18
-
Melting point / °C
111.5
116
122.5
126
141.5
152
154
Component /%
Sn
-
-
-
37.5
-
-
-
Pb
44
-
-
37.5
-
-
-
Cd
55
24.25
27
-
-
-
-
other
-
Zn1.75
-
-
Zn2
Ge0.6
Ge0.5
5. Indium-based solders with melting points of 47-234 ° C (see Table 3), such as indium and tin, antimony and lead, have good electrical conductivity, mechanical properties and anti-corrosion properties. It is required for both electronic and cryogenic physics, as well as a special solder for machinery and chlor-alkali industries.
Table 3 Indium-based solder (the remainder of the component is indium)
Melting point / °C
47
72
77.5
79
93
Component /%
Sn
-
-
-
17
42
Pb
-
-
-
-
-
Bi
81.9
33.7
48.5
57
-
Cd
-
-
16
-
14
Ag
-
-
-
-
-
Melting point / °C
109
116
118
123
144
Component /%
Sn
-
-
48
-
-
Pb
-
50
-
-
-
Bi
67
-
-
-
-
Cd
-
-
-
25
-
Ag
-
-
-
-
10
Melting point / °C
147
151.5
153
158
234
Component /%
Sn
-
-
-
-
-
Pb
5
-
1.5
20.7
75
Bi
-
-
-
-
-
Cd
5
-
-
-
-
Ag
-
5
-
-
-

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