Artificial Intelligence
Traditional epoxy plastic materials industry will face enormous challenges
Epoxy resin composites are primarily made up of epoxy resin, crosslinking agents, curing accelerators, and various additives. These materials exhibit a wide range of excellent properties, including good thermal stability, electrical insulation, strong adhesion, superior mechanical performance, ease of processing, and cost-effectiveness. As a result, they are widely used in electronic applications such as component bonding, packaging, and printed circuit board manufacturing, making them one of the most critical chemical materials in the electronics industry. Depending on their application areas, epoxy resin composites can be categorized into different types, such as epoxy molding compounds (EMC), base materials for printed wiring boards (PWBs), and electronic component adhesives like conductive, thermally conductive, and chip-mounting adhesives.
In recent years, with the advancement of microelectronics and growing global environmental awareness, there has been an increasing demand for eco-friendly epoxy resin formulations. Traditional epoxy composites are now facing significant challenges across multiple dimensions. One major challenge comes from flame retardants. Most commonly used flame retardants today are halogen-based or contain antimony. The presence of these substances can lead to serious issues, such as the release of toxic gases like dioxins and benzofurans when burned. These gases can cause metabolic disorders, leading to symptoms such as stress, insomnia, headaches, eye problems, arteriosclerosis, and even liver cancer. Animal studies have shown that they can cause cancer. Additionally, the disposal of halogen-containing waste is extremely difficult, making the use of such flame retardants increasingly restricted.
The European Union had already drafted the fifth edition of the Waste Electrical and Electronic Equipment (WEEE) Directive back in June 2000, which included regulations banning halogen-free electronic materials, specifically substances like PBB and PBDE, effective from January 1st. Another significant challenge comes from the shift toward lead-free solder. Lead in traditional solder can be dissolved by acid rain and accumulate in the human body through food and water, causing heavy metal poisoning and serious health risks. Consequently, lead-containing additives have also been strictly prohibited under the WEEE directive. As a result, the development of lead-free solder has become an essential trend. However, current lead-free solders have higher melting points, raising reflow temperatures from 230–245°C to 250–265°C, which presents new challenges for material compatibility.
Moreover, the packaging process itself has undergone significant changes. In recent years, semiconductor packaging technology has seen three major transformations. The first occurred in the early 1970s, characterized by a shift from through-hole packaging (like DIP) to surface mount technology (such as QFP). The second transformation in the mid-1990s saw a move from four-sided leaded packages to planar array packages (like BGA). The third transformation, beginning in the early 2000s, includes innovations such as chip-scale packaging (CSP), 3D stacked packaging, and full wafer-level packaging. Throughout these changes, the role of packaging materials has grown increasingly important, becoming a key factor in achieving optimal performance of integrated circuits.
To meet the evolving demands of advanced packaging technologies, new epoxy molding compounds must possess high heat resistance, low moisture absorption, minimal stress, and cost efficiency. However, traditional epoxy resins are inherently flammable, requiring the addition of flame retardants. Unfortunately, conventional epoxy sealants struggle to satisfy all these requirements simultaneously. Therefore, the development of high-performance, environmentally friendly epoxy resin sealants has become an urgent necessity.
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